What is the process of making electrical contact on the piezoceramicside attached downwards ?

Between the piezo part and the metal substrate the most effective technique is to create a conductive bond. One electrical lead is connected to the outward side of the piezoceramic sheet while on electrical lead is connected to the substrate especially when the substrate is plastic or glass. At a position of the downside of the ceramic a wire is needed to be soldered. During the boding of piezo sheet to the substrate, a consistent ‘overhang’, ‘dish’, ‘cutout’ should be used to the wire may have room.